-------- Forwarded Message -------- Subject: IEEE 2019 International Conference on Industrial Cyber-Physical Systems Date: Sat, 1 Dec 2018 15:51:21 -0600 From: IEEE Industrial Electronics Society ieee-ies@auburn.edu

Call for Papers

2019 IEEE International Conference on Industrial Cyber-Physical Systems (ICPS 2019) 2019 IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI2019)

May 6-9, 2018 Howard Plaza Hotel Taipei, Taiwan http://icps19.org/

Dear Colleagues,

Due to the extraordinary interest in ICPS & MFI 2019 and numerous requests we have decided to extend the due dates for the proposal of special sessions and paper submission as follows:

Submission deadline (EXTENDED): December 31st, 2018 Notification of acceptance: March 1st, 2019 Submission of final version: April 1st, 2019

Guidelines for submitting full papers via the online submission system are posted on the ICPS 2019 website: http://icps19.org/ Accepted and presented papers will be published in the conference proceedings, and submitted for inclusion in IEEE Xplore on-line digital library.

You are sincerely invited to submit your contributions to IEEE ICPS 2019 & IEEE MFI 2019 !

IEEE International Conference on Industrial Cyber-Physical Systems (ICPS) and IEEE International Conference on Multisensor Fusion and Integration for Intelligent Systems (MFI), are to provide a platform to exchange research and innovation results, share experiences on lessons learned from industrial practices associated with new paradigm shifts and technologies.

ICPS 2019 and MFI 2019 are going to be the conference series presenting the state of the art and future perspectives of Industrial Cyber-Physical Systems and Multisensor Fusion and Integration for Intelligent Systems. The conference organizing committee will synthesize joint wisdom in preparing enriched program so that the industry experts, researchers, and academia can share ideas and experiences surrounding frontier technologies, breakthrough and innovative solutions and applications

Topics: The scope of the conference will cover, but will not be limited to, the following topics: * CPS Architectures * CPS Technologies * CPS Engineering * CPS Applications * CPS Management and Ecosystem * CPS Education and Social Aspects * Multisensor Fusion and Integration

Plus 14 Special Sessions on specific, emerging topics which are also open for submission. The world’s industry practitioners, researchers and academia are cordially invited to participate in this exciting event and enjoy the wonderful city of Taipei

For more information, please visit http://icps19.org Welcome and look forward to receiving your contributions and see you at ICPS 2019 & MFI 2019!

General Co-Chairs of ICPS 2019 Ren Luo, Armando W. Colombo, Stamatis Karnouskos, Yang Shi

General Co-Chairs of MFI 2019 Ren Luo, Thomas C. Henderson, Uwe D. Hanebeck, Sukhan Lee, Jianwei Zhang

Technical Program Chairs of ICPS2019&MFI2019 A. Luque, J. M. Lastra, S. Hu, L. Gomes, C. Tsai, F. Golatowski, S. Yin ------------------------------------------------------------

-- IEEE IES conferences. To unsubscribe: http://submit.ieee-ies.org/php/emailremove.php