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Call for Papers
2019 IEEE International Conference on Industrial Cyber-Physical
Systems (ICPS 2019)
2019 IEEE International Conference on Multisensor Fusion and
Integration for Intelligent Systems (MFI2019)
May 6-9, 2018 Howard Plaza Hotel Taipei, Taiwan
http://icps19.org/
Dear Colleagues,
Due to the extraordinary interest in ICPS & MFI 2019 and
numerous requests we have
decided to extend the due dates for the proposal of special
sessions and paper
submission as follows:
Submission deadline (EXTENDED): December 31st, 2018
Notification of acceptance: March 1st, 2019
Submission of final version: April 1st, 2019
Guidelines for submitting full papers via the online submission
system are
posted on the ICPS 2019 website:
http://icps19.org/
Accepted and presented papers will be published in the conference
proceedings, and submitted for inclusion in IEEE Xplore on-line
digital library.
You are sincerely invited to submit your contributions to IEEE
ICPS 2019 & IEEE MFI 2019 !
IEEE International Conference on Industrial Cyber-Physical Systems
(ICPS) and IEEE International Conference on Multisensor Fusion and
Integration for Intelligent Systems (MFI), are to provide a
platform to exchange research and innovation results, share
experiences on lessons learned from industrial practices
associated with new paradigm shifts and technologies.
ICPS 2019 and MFI 2019 are going to be the conference series
presenting the state of the art and future perspectives of
Industrial Cyber-Physical Systems and Multisensor Fusion and
Integration for Intelligent Systems. The conference organizing
committee will synthesize joint wisdom in preparing enriched
program so that the industry experts, researchers, and academia
can share ideas and experiences surrounding frontier technologies,
breakthrough and innovative solutions and applications
Topics:
The scope of the conference will cover, but will not be limited
to,
the following topics: * CPS Architectures
* CPS Technologies
* CPS Engineering
* CPS Applications
* CPS Management and Ecosystem
* CPS Education and Social Aspects
* Multisensor Fusion and Integration
Plus 14 Special Sessions on specific, emerging topics which are
also open for submission.
The world’s industry practitioners, researchers and academia are
cordially invited to participate in this exciting event and enjoy
the wonderful city of Taipei
For more information, please visit
http://icps19.org
Welcome and look forward to receiving your contributions and see
you at ICPS 2019 & MFI 2019!
General Co-Chairs of ICPS 2019
Ren Luo, Armando W. Colombo, Stamatis Karnouskos, Yang Shi
General Co-Chairs of MFI 2019
Ren Luo, Thomas C. Henderson, Uwe D. Hanebeck, Sukhan Lee, Jianwei
Zhang
Technical Program Chairs of ICPS2019&MFI2019
A. Luque, J. M. Lastra, S. Hu, L. Gomes, C. Tsai, F. Golatowski,
S. Yin
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