-------- Forwarded Message -------- Subject: [Extended Deadline: Dec. 20] - COINS 2019: Internet of Things | Artificial Intelligence & ML | Big Data | Blockchain | Edge & Cloud Computing | Security | Embedded System | EDA Date: Mon, 3 Dec 2018 13:28:30 +0100 From: Farshad Firouzi farshadfirouzi@gmail.com To: gustaf.neumann@wu.ac.at

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*COINS 2019: International Conference on Omni-Layer Intelligent Systems *

Crete, Greece | May 5-7, 2019

Extended Deadline: December 20, 2018 http://coinsconf.com http://coinsconf.com/

COINS is the premier conference devoted to omni-layer techniques for smart IoT systems, by identifying new perspectives and highlighting impending research issues and challenges. COINS main topics include the following but are not limited to:

Track 1: Internet of Things: From Device to Edge, and Cloud Track 2: Omni-Layer Security, Privacy, and Trust Track 3: Omni-layer Reliability in IoT Era Track 4: VLSI, EDA, Embedded Systems, and Computer Architecture Track 5: Real-time Systems Track 6: Alternative and Approximate Computing Track 7: Cloud Computing Track 8: Programming Language and Software Engineering Track 9: Big Data Track 10: Artificial Intelligence, Machine Learning, Cognitive Computing, and Advanced Analytics Track 11: Evolutionary Computer Vision, Image Processing and Pattern Recognition Track 12: Automation Systems Track 13: Automotive Systems Track 14: Intelligent IoT eHealth Track 15: Enterprise Architecture

Special tracks:

Track1: Blockchain and Internet of Things (IoT) Track2: Cyber-physical and embedded systems Track3: Critical System Design Track4: Face Recognition

*_Publication_*

COINS is sponsored by IEEE Council on Electronic Design Automation (CEDA). Moreover, the proceeding will be published in ACM. Accepted papers are allowed six pages in the conference proceedings free of charge. Each additional page beyond six pages is subject to the page charge at 150 Euro per page up to the eight-page limit. ACM will hold the copyright for COINS proceedings. Authors of accepted papers must sign an ACM copyright release form for their paper.

Extended versions of selected best papers will be published in a special issue of the ISI indexed Elsevier journal “Microprocessors and Microsystems: Embedded Hardware Design” (MICPRO) having the 2016 Impact Factor as high as 1.025

*_Important Date_*

Submission Deadline: December 20 2018 Notification Date: January 31, 2019 Camera-ready: February 10, 2019 Conference Dates: May 5-7, 2019

*_Grant_*

COINS Executive Committee is pleased to announce registration grants for highly skilled students who have an accepted paper. The number of grants is limited; therefore, the funding is awarded on a competition basis. We are especially looking forward to applications from Middle East, and Asia.

*_Board_*

Prof. Krishnendu Chakrabarty, Duke University, USA

Prof. Jan M. Rabaey, UC Berkeley, USA

Prof. David Z. Pan, University of Texas at Austin, USA

Prof. Majid Sarrafzadeh, UCLA, USA

Dr.-Ing. Farshad Firouzi, mVISE AG, Germany

*_General Chairs_*

Dr.-Ing. Farshad Firouzi, mVISE AG, Germany

Prof. Krishnendu Chakrabarty, Duke University, USA

*_Technical Chairs_*

Dr. Bahar Farahani, Shahid Beheshti University, Iran

Dr. Fangming Ye, Huawei, USA

Dr. Vasilis Pavlidis, University of Manchester, UK

*_Local Chair: _*Prof. Paris Kitsos, Technological Educational Institute of Western Greece, Greece

*_Publicity Chair _*Prof. Nicolas Sklavos, University of Patras, Hellas, Greece

*_Track Chairs: _*Prof. Jörg Henkel, KIT, Germany

Prof. Akash Kumar, TU Dresden, Germany

Prof. Davide Brunelli, University of Trento, Italy

Prof. Kostas Siozios, Aristotle University of Thessaloniki, Greece

Prof. Matthias König, FH-Bielefeld University, Germany

Prof. Maria K. Michael, University of Cyprus, Cyprus

Prof. Jiang Li, Shanghai Jiaotong University, China

Prof. Luís Ferreira Pires, University of Twente, Netherlands

Prof. Federica Cena, Universita' di Torino, Italy

Prof. Mehrnoush Shamsfard, SBU, Iran

Prof. Pasi Liljeberg, University of Turku, Finland

Prof. Fereidoon Shams Aliee, SBU, Iran

Prof. Kostas Siozios, Aristotle University of Thessaloniki, Greece

Dr. Farzad Samie, KIT, Germany