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Call-for-Papers
2019 IEEE International Conference on Industrial Cyber-Physical
Systems (ICPS 2019)
2019 IEEE International Conference on Multisensor Fusion and
Integration for Intelligent Systems (MFI2019)
May 6-9, 2018 Howard Plaza Hotel Taipei, Taiwan
http://icps19.org/
Dear Colleagues,
You are sincerely invited to submit your contributions to IEEE
ICPS 2019 & IEEE MFI 2019 !
IEEE International Conference on Industrial Cyber-Physical Systems
(ICPS) and IEEE International Conference on Multisensor Fusion and
Integration for Intelligent Systems (MFI), are to provide a
platform to exchange research and innovation results, share
experiences on lessons learned from industrial practices
associated with new paradigm shifts and technologies.
ICPS 2019 and MFI 2019 are going to be the conference series
presenting the state of the art and future perspectives of
Industrial Cyber-Physical Systems and Multisensor Fusion and
Integration for Intelligent Systems. The conference organizing
committee will synthesize joint wisdom in preparing enriched
program so that the industry experts, researchers, and academia
can share ideas and experiences surrounding frontier technologies,
breakthrough and innovative solutions and applications
The world’s industry practitioners, researchers and academia are
cordially invited to participate in this exciting event and enjoy
the wonderful city of Taipei
Important dates:
Special Session Proposals: October 31, 2018
Contributed Papers: November 30, 2018
Notification of Acceptance: January 31, 2019
FOR MORE INFORMATION, please visit
http://icps19.org
Welcome and look forward to receiving your contributions and see
you at ICPS 2019 & MFI 2019!
General Co-Chairs of ICPS 2019
Ren Luo, Armando W. Colombo, Stamatis Karnouskos, Yang Shi
General Co-Chairs of MFI 2019
Ren Luo, Thomas C. Henderson, Uwe D. Hanebeck, Sukhan Lee, Jianwei
Zhang
Technical Program Chair of ICPS2019&MFI2019
Prof. Antonio Luque Estepa, Universidad de Sevilla, Spain
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