IEEE Circuits & Systems Society
IEEE Communications Society
IEEE Computer Society
IEEE Signal Processing Society

With nearly 1200 submissions in 2011, the IEEE International Conference on Multimedia & Expo (ICME) has been the flagship multimedia conference sponsored by four IEEE societies since 2000. It serves as a forum to promote the exchange of the latest advances in multimedia technologies, systems, and applications from both the research and development perspectives of the circuits and systems, communications, computer, and signal processing communities. In 2013, an Exposition of multimedia products, animations and industries will be held in conjunction with the conference.

Authors are invited to submit a full paper (two-column format, 6 pages maximum) according to the guidelines available on the conference website at www.icme2013.org. Only electronic submissions will be accepted. Topics of interest include, but are not limited to:

- Speech, audio, image, video, text processing
- Signal processing for media integration
- 3D visualization, animation and virtual reality
- 3D imaging and 3DTV
- Multi-modal multimedia computing systems and human-machine interaction
- Multimedia communications and networking
- Multimedia security and content protection
- Multimedia databases and digital libraries
- Multimedia applications and services
- Media content analysis
- Multimedia standards and related issues
- Multimedia quality assessment

ICME 2013 aims to have high quality oral and poster presentations. Several awards sponsored by industrial and scholarly organizations will be presented. Best papers will be presented in a single-track session to all participants. Accepted papers must be presented at the conference in order to be included in the IEEE Xplore Library.

A number of Workshops will be organized by the sponsoring societies. To further foster new emerging topics, ICME 2013 also welcomes researchers, developers, and practitioners to organize regular Workshops. Potential organizers please contact the Workshop Chairs for further details. Proposals for Tutorials, Demos, and Exhibitions are also encouraged. Please visit the ICME 2013 website for submission details.

Schedule:

- Regular Paper Abstract Submission:December 10, 2012
- Regular Paper Submission:December 15, 2012
- Workshop & Demo Paper Submission:February 20, 2013
- Industrial & Application Short Paper Submission:March 31, 2013
- Notification of Regular Paper Acceptance:March 1, 2013
- Notification of Workshop and Demo Paper Acceptance:April 15, 2013
- Camera-Ready Paper Due:April 30, 2013
- Workshop Proposal Due:December 31, 2012
- Tutorial Proposal Due:January 31, 2013

Contact:
Email: webmaster@icme2013.org
Website: www.icme2013.org

Organizing Committee

General Chairs
Anup Basu, University of Alberta, Canada
Nam Ling, Santa Clara University, USA
Sethuraman Panchanatha, Arizona State University, USA

Program Chair
Demetri Terzopoulos, University of California, Los Angeles, USA

Society Program Co-Chairs
Alan Hanjalic, Delft University of Technology, Netherlands - IEEE Signal Processing Society Representative
Belle Tseng, Apple, USA - IEEE Circuits and Systems Society Representative
Mohan Kankanhalli, National University of Singapore, Singapore - IEEE Computer Society Representative
Weisi Lin, Nanyang Technological University, Singapore - IEEE Communications Society Representative

Workshop Chairs
Zhengguo Li, Institute for Infocomm Research, Singapore
Maria Luisa Sapino, University of Torino, Italy
Timothy K. Shih, National Central University, Taiwan

Tutorial Chairs
Aljoscha Smolic, Disney Research, Zurich, Switzerland
Shervin Shirmohammadi, University of Ottawa, Canada
Tokunbo Ogunfunmi, Santa Clara University, USA

Theme Chairs
Irene Cheng, University of Alberta, Canada
Abdulmotaleb El Saddik, University of Ottawa, Canada
Haohong Wang, TCL Research America, USA

Panel Chairs
Alberto Del Bimbo, University of Firenze, Italy
Lingzhi Liu, Intel, USA

Local/Events Chairs
Mrinal Mandal, University of Alberta, Canada
Ted Selker, Carnegie Mellon University, Silicon Valley, USA

Industrial Program Chairs
Tom Malzbender, HP Labs, USA
Cha Zhang, Microsoft Research, USA

Industrial/Short Papers Chairs
Xian-Sheng Hua, Microsoft Research, USA
Fan Zhai, Texas Instruments, USA
Andres Kwasinski, Rochester Institute of Technology, USA
Jonathan Wu, University of Windsor, Canada

Expo Chairs
Frederic Dufaux, Telecom ParisTech, France
Jiang Zhu, Cisco Systems, USA
Seyfullah Halit Oguz, Qualcomm, USA
Zhu Li, Huawei, USA
Sriganesh Madhvanath, HP Labs, India
Zhihui Xiong, National University of Defense Technology, China

Finance Chairs
Xiao Su, San Jose State University, USA
Vicky Zhao, University of Alberta, Canada

Publicity Chairs
Pradeep K. Atrey, University of Winnipeg, Canada
Guillaume Lavoué, INSA Lyon, France
Li Song, Shanghai Jiao Tong University, China
Myung Hoon Sunwoo, Ajou University, Korea

Sponsorship Chairs
J. Zhu, Griffith University, Australia
Seyfullah Halit Oguz, Qualcomm, USA
Sriganesh Madhvanath, HP Labs, India
Zhu Li, Huawei, USA

Publications Chair
Xenophon Zabulis, FORTH, Greece

Web Chair
Rui Shen, University of Alberta, Canada