-------- Weitergeleitete Nachricht -------- Betreff: [WI] ICNC 2018 at Hawaii – Deadline in a Week Datum: Sun, 2 Jul 2017 06:12:51 +0800 (CST) Von: confpublicity@gmail.com Antwort an: confpublicity@gmail.com An: wi@aifb.uni-karlsruhe.de
Dear friend,
It is the last week to submit your papers to ICNC 2018 (http://www.conf-icnc.org/2018/). The paper submission link is:
As usual, ICNC is presenting a world top tier program to our attendees at Maui, Hawaii next March with around 50 high-profile speakers in the areas of AI, data science, computing, networking and communications. Please check out ICNC’18 website: http://www.conf-icnc.org/2018/ for more details.
Invited Speakers (partial list, in name alphabet order):
Fumiyuki Adachi, Tohoku Univ, Japan (IEEE/IEICE Fellow) Ender Ayanoglu, UCI, USA (IEEE Fellow) Nick Bambos, Stanford Univ, USA Robert Calderbank, Duke Univ, USA (NAE member, IEEE/AAAS Fellow, AT&T Fellow) Tracy Camp, Colorado School of Mines, USA (ACM/IEEE Fellow) Michael J. Carey, UCI, USA (NAE member, ACM/IEEE Fellow) Luiz DaSilva, Trinity College Dublin, Ireland (IEEE Fellow) Klaus Doppler, Nokia, USA Falko Dressler, Univ. Paderborn, Germany (IEEE Fellow) Schahram Dustdar, TU Wien, Austria (IEEE Fellow) Jeffrey Foerster, Intel, USA (IEEE Fellow) Haris Gacanin, Nokia, Belgium Georgios Giannakis, Univ. Minnesota, USA (IEEE/EURASIP Fellow) Mario Gerla, UCLA, USA (ACM/IEEE Fellow) Zhu Han, Univ. Houston, USA (IEEE Fellow) Anders Host-Madsen, Univ. Hawaii, USA (IEEE Fellow) Aggelos K. Katsaggelos, Northwestern Univ, USA (IEEE/SPIE/EURASIP Fellow) Marwan Krunz, Univ. Arizona, USA (IEEE Fellow) Victor C.M. Leung, UBC, Canada (IEEE/RSC/EIC/CAE Fellow) Jiangchuan Liu, SFU, Canada (IEEE Fellow) Wenjing Lou, Virginia Tech (IEEE Fellow) Panos Nasiopoulos, UBC, Canada (IEEE/CAE Fellow) Eiji Oki, Kyoto Univ, Japan (IEEE/IEICE Fellow) Ashutosh Sabharwal, Rice Univ, USA (IEEE Fellow) Hikmet Sari, Supelec, France (IEEE Fellow, EA/TSA member) Henning Schulzrinne, CTO, FCC, USA (ACM/IEEE Fellow) Hamid Sharif, Univ. Nebraska-Lincoln, USA (IEEE Fellow) Shervin Shirmohammadi, Univ. Ottawa, Canada (IEEE Fellow) Ness B. Shroff, Ohio State University, USA (IEEE Fellow) Anthony C. K. Soong, Huawei, USA (IEEE Fellow) Manos M. Tentzeris, Georgia Tech, USA (IEEE Fellow) Zhi Tian, George Mason Univ, USA (IEEE Fellow) Toshitaka Tsuda, Waseda Univ, Japan (IEEE/IEICE Fellow) Li-Chun Wang, NCTU, Taiwan (IEEE Fellow) Vincent Wong, UBC, Canada (IEEE Fellow) Naoaki Yamanaka, Keio Univ, Japan (IEEE/IEICE Fellow) Liuqing Yang, Colorado State Univ, USA (IEEE Fellow) Michele Zorzi, Univ. Padova, Italy (IEEE Fellow)
We encourage you to submit papers to the ICNC 2018 before the paper submission deadline of July 5, 2017, and plan to spend a nice and warm winter vacation at Hawaii!
ICNC 2018 TPC Team http://www.conf-icnc.org/
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