| Betreff: | IEEE DataCom 2017 - Orlando, Florida, USA, November 6-10, 2017 |
|---|---|
| Datum: | Thu, 1 Jun 2017 01:43:58 +0800 (CST) |
| Von: | CSPlus-Admin <cfp-admin@grid.chu.edu.tw> |
| Antwort an: | CSPlus-Admin <cfp-admin@grid.chu.edu.tw> |
| An: | neumann@wu-wien.ac.at |
*************************************************************************************************************************************************************************************************** Apologies if you got multiple copies of this email. If you'd like to opt out of these announcements, information on how to unsubscribe is available at the bottom of this email. *************************************************************************************************************************************************************************************************** Dear Colleagues: We cordially invite you to share your latest research results related to Big Data, and Cloud Computing at the IEEE DataCopm 2017 conference. The conference proceedings of DataCom 2017 will be published by IEEE CPS and submitted to IEEE Xplore and indexing services such as EI and ISSN. Selected papers will be published in special issues of prestigious international journals. IEEE DataCom 2017 also welcomes works-in-progress paper, industry paper, demo & poster papers. IEEE International Conference on Big Data Intelligence and Computing（IEEE DataCom 2017） http://grid.chu.edu.tw/datacom2017 --------------------------- CALL FOR PAPERS --------------------------- Big data is a rapidly expanding research area spanning the fields of computer science and information management, and has become a ubiquitous term in understanding and solving complex problems in different disciplinary fields such as engineering, applied mathematics, medicine, computational biology, healthcare, social networks, finance, business, government, education, transportation and telecommunications. The goal of the IEEE International Conference on Big Data Intelligence and Computing (IEEE DataCom 2017) is to establish an international forum for engineers and scientists to present their ideas and experiences in the fields of Big Data intelligence and computing. IEEE DataCom 2017 welcomes paper submissions on innovative work from researchers in academia, industry and government describing original research work in Big Data. Authors of selected papers will be invited to submit an extended version (with at least 30% new material) for review and publication in special issues of international journals. IEEE DataCom 2017 will be held on November 6-10, 2017 in Orlando, Florida, USA. Topics of interest include, but are not limited to: - The 5Vs of the data landscape: volume, variety, velocity, veracity, value - Big data science and foundations, analytics, visualization and semantics - Software and tools for big data management. - Security, privacy and legal issues specific to big data - Big data economy, QoS and business models - Scientific discovery and business intelligence - Software, hardware and algorithm co-design, high-performance computing - Large-scale recommendation systems and graph analysis - Infrastructures and systems for big data analytics and managements - Middleware and tools for big data analytics and managements - Algorithmic, experimental, prototyping and implementation - Data quality issues: such as validation, metrics, optimizations and consistency - Data-driven innovation, computational modelling and data integration - Data intensive computing theorems and technologies - Big data for advanced manufacturing and productivity - Modeling, simulation and performance evaluation - Green data centers / environmental-friendly perspectives - Computing, scheduling and resource management for sustainability - Complex applications in areas where massive data is generated ---------------------------------------- PUBLICATION HIGHLIGHTS ---------------------------------------- IEEE CS proceedings, indexed by - IEEE Xplore - Scopus - EI Engineering Index - ACM Digital Library - dblp - Google Scholar Extended version of the selected papers will be invited for publication in prestigious international journals. ---------------------------- IMPORTANT DATES ---------------------------- Paper Submission (Research Track): June 15, 2017 Paper Submission (Works-in-Progress/workshop): July 10, 2017 Author Notification (Research/workshop/WIP): July 30, 2017 Paper Submission (Demo /Poster /Special session): August 5th, 2017 Author Notification (Research/workshop/WIP/Poster): August 20, 2017 Camera ready / registration deadline: August 31, 2017 —----------------- SUBMISSION —----------------- Authors are invited to submit their original research work that has not previously been submitted or published in any other venue. Papers should be prepared in IEEE CS format and submitted via the IEEE DataCom 2017 web site, https://easychair.org/conferences/?conf=ieeedatacom2017 IEEE formatting information: http://www.ieee.org/conferences_events/conferences/publishing/templates.html - Proposals for organizing tutorials, workshops and special sessions need to be submitted to the Tutorials, Workshops and Special Sessions Chairs, respectively. A proposal should include title, theme, scope and main presenters/organizers. - Research paper (8 pages) should explore a specific technology problem and propose a complete solution to it, with experimental results. - Works-in-Progess (WIP) (6 pages) papers are expected to present either work currently in progress or less developed but highly innovative ideas. - Demo/Poster papers (4 pages) must describe working systems and be related to DataCom. These systems may be innovative prototype implementations or mature systems that use related technology. Papers/proposals need to be submitted to the Demo/Poster Chair. - Workshop and Special Session papers need to be submitted to the corresponding workshops and special sessions. All accepted papers in the main tracks, workshops, special sessions and demos/posters will be published in an IEEE Computer Society proceedings (EI indexed). Extended versions of selected excellent papers will be considered for publication in special issues of prestige journals (SCI/EI indexed). ------------------------------- Organizing Committees ------------------------------- General Chairs Sanjay Ranka, University of Florida, USA Hai Jin, HUST, China Manu Malek, Stevens Inst. of Tech., USA General Executive Chairs Jun Wang, University of Central Florida, USA Tao Li, NSF/UFL, USA Program Chairs Anna Kobusinska, Poznan University of Technology, Poland Xiaolin Li, University of Florida, USA Wenguang Chen, Tsinghua University, China Workshop Chairs I-Hsin Chung, IBM Thomas J. Watson Research Center, USA Wuu Yang, National Chiao Tung University, Taiwan Demo/Poster Chair Che-Rung Lee, Tsing Hua University, Taiwan Special Session Chair Hai Jiang, Arkansas State University, USA Award Chair Weisong Shi, Wayne State University, USA International Liaison & Publicity Chair Bingsheng He, Nanyang Technological University, Singapore Jun Huang, Chongqing University of Posts and Telecommunications, China Bahman Javadi, Western Sydney University, Australia William Liu, Auckland University of Technology, and Zealand Bhekisipho Twala, Univ. Johannesburg, South Africa Hao Wang, Norwegian University of Science and Technology, Norway Sheng-De Wang, National Taiwan University, Taiwan Publication Chair Hui-Huang Hsu, Tamkang University, Taiwan Advisory Committee Robert Hsu, Chung Hua University, Taiwan Geoffrey Fox, Indiana University, USA Yuanyuan Yang, Stony Brook University, USA Christophe Cérin, University of Paris XIII, France Yeh-Ching Chung, National Tsing Hua University, Taiwan Jie Li, University of Tsukuba, Japan Beniamino Di Martino, Second University of Naples, Italy Domenico Talia, Università della Calabria, Italy Vincent S. Tseng, National Chiao Tung Univ. Taiwan Cho-Li Wang, The Univ. of Hong Kong, Hong Kong Jinsong Wu, University de Chile, Chile Jinjun Chen, Swinburne University of Technology, Australia Please visit the IEEE DataCom 2017 website http://grid.chu.edu.tw/datacom2017/tpc.php for the complete listing of organizing committee and TPC members. *************************************************************************************************************************************************************************************************** The CSPlus (Computational Science Publicity and Liaison for Ubiquitous Society) mailing list has been setup to share information with respect to upcoming events. To unsubscribe, please click http://grid.chu.edu.tw/mailling_list/unsubscribe.php?mail=neumann@wu-wien.ac.at To subscribe another email: please visit http://grid.chu.edu.tw/mailling_list/index.php If you need any help, please email us at cfp-admin@grid.chu.edu.tw ***************************************************************************************************************************************************************************************************