-------- Forwarded Message -------- Subject: [AISWorld] ScaDL workshop call for paper Date: Sat, 18 Jan 2020 17:45:37 +0000 From: Danilo Ardagna danilo.ardagna@polimi.it To: aisworld@lists.aisnet.org aisworld@lists.aisnet.org
Dear Colleagues, this is an invitation to submit a research paper to the ScaDL 2020 workshop at IPDPS 2020. I hope this can be of interest to you. You are kindly invited to spread the information.
Apologies if you receive multiple copies of the call for papers.
---------------------- ScaDL 2020: 2nd Workshop on Scalable Deep Learning over Parallel and Distributed Infrastructure Colocated with IPDPS 2020 https://2020.scadl.org/call-for-papers ----------------------
Areas of Interest In this workshop, we solicit research papers focused on distributed deep learning aiming to achieve efficiency and scalability for deep learning jobs over distributed and parallel systems. Papers focusing both on algorithms as well as systems are welcome. We invite authors to submit papers on topics including but not limited to: -Deep learning on HPC systems -Deep learning for edge devices -Model-parallel and data-parallel techniques -Asynchronous SGD for Training DNNs -Communication-Efficient Training of DNNs -Model/data/gradient compression -Learning in Resource constrained environments -Elasticity training of machine learning and deep learning jobs -Hyper-parameter tuning for deep learning jobs -Hardware Acceleration for Deep Learning -Scalability of deep learning jobs on large number of nodes -Deep learning on heterogeneous infrastructure -Efficient and Scalable Inference -Data storage/access in shared networks for deep learning jobs Author Instructions ScaDL 2020 accepts submissions in three categories: Regular papers: 8-10 pages Short papers: 4 pages Extended abstracts: 1 page The aforementioned lengths include all technical content, references and appendices. Papers should be formatted using IEEE conference style, including figures, tables, and references. The IEEE conference style templates for MS Word and LaTeX provided by IEEE eXpress Conference Publishing are available for download. See the latest versions at https://www.ieee.org/conferences/publishing/templates.html Submission Link https://easychair.org/conferences/?conf=scadl2020
Deadlines Submission deadline: Feb 1, 2020 Notifications: Feb 28, 2020 Camera Ready deadline: March 15, 2020
General Chairs Christopher Carothers, RPI, USA Ashish Verma, IBM Research AI, USA Program Committee Chairs K. R. Jayaram, IBM Research AI, USA Parijat Dube, IBM Research AI, USA
Program Committee Kangwook Lee, KAIST, Korea Li Zhang, IBM Research, USA Xiangru Lian, U Rochester, USA Eduardo Rocha Rodrigues, IBM, Brazil Wagner Meira Jr., UFMG, Brazil Stacy Patterson, RPI, USA Alex Gittens, RPI, USA Catherine Schuman, ORNL, USA Ignacio Blanquer, UPV, Spain Leandro Balby Marinho, UFCG, Brazil Chen Wang, IBM Research, USA
Publicity Chair Danilo Ardagna, Politecnico di Milano, Italy
Steering Committee Vijay K. Garg, University of Texas at Austin Vinod Muthusamy, IBM Research AI Yogish Sabharwal, IBM Research AI Danilo Ardagna, Politecnico di Milano -------------- Danilo Ardagna Politecnico di Milano Dipartimento di Elettronica, Informazione e Bioingegneria Via Golgi 42 20133 Milano, Italy Phone: +39 02 2399 3514 Fax: +39 02 2399 3574 e-mail: danilo.ardagna@polimi.it web: http://ardagna.faculty.polimi.it http://www.atmosphere-eubrazil.eu http://www.dice-h2020.eu http://www.eubra-bigsea.eu
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