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The 7th IEEE International Conference
on e-Business Engineering (ICEBE 2010,
http://conferences.computer.org/icebe/)
is a prestigious conference which is initiated from 2003 by the IEEE
Technical
Committee on E-Commerce.
ICEBE is a high-quality international
forum for researchers and practitioners from different areas of
computer
science and information systems to exchange their latest findings and
experiences,
as well as to help shape the future of IT-transformed consumers,
enterprises,
governments and markets.
The conference scope spans the areas
of Web, databases, service science, multimedia, information systems and
electronic marketplaces.The Green Supply Chain, Business and RFID Track
includes but not limited to the following topics:
*RFID and automation
*Carbon footprint, accounting and
trading
*Energy efficient computing and
enabling
technologies
*Green business, organization,
technology
and practices
*Green ecosystems and sustainable
development
*Green logistics and supply chain
management
*Standards, regulations, and legal
issues
Full papers must not exceed 8 pages,
using IEEE two-column template. All papers should be in Adobe portable
document format (PDF) format. Authors should submit their paper via
electronic
submission system. All papers selected for this conference are
peer-reviewed
and will be published in the regular conference proceedings by the IEEE
Computer Society Press. Submissions must not be published or submitted
for another conference. The best quality papers presented in the
conference
will be selected for journal special issues by creating an extended
version.
At least one author of each accepted
submission must attend the conference to present the work. Authors
should
submit their papers, via electronic submission system in the following
link (Paper Submission Deadline June 1, 2010):
URL:
https://www.easychair.org/login.cgi?conf=ieeeicebe2010
The conference will take place on
10-12
November, 2010 at Fudan University, Shanghai, China.
In addition to the main tracks
including
Green Supply Chain, Business and RFID Track, there is a co-located
Workshop:
The First International Workshop on
Engineering Low-Carbon Business (ELCB'10)
(November 10-12, 2010, Shanghai,
China,
in conjunction with ICEBE 2010)
The international workshop on
Engineering
Low-Carbon Business (ELCM) is to provide a prestigious forum of
disseminating
innovative findings of e-business relevant issues related to the
design,
commercialization and use of services, processes and products that are
feasible, economical, and environmentally friendly. The workshop will
cover
the theories, engineering and technological progressions in low carbon
research and practices in facilitating relevant technology and practice
adoption to enhance competitiveness towards enabling efficient and
sustainable
economy.
The workshop solicits paper
submissions
in a wide range of related topics, including, but not limited to, the
following:
*Carbon footprint, accounting, and
trading
*Emerging low carbon business models
and practices
*Energy efficient computing and
enabling
technologies
*Monitoring and supervision
technologies
*Green organization, technology and
practices
*Green ecosystems and sustainable
development
*Green facilities, production, and
logistics
*RFID and automation
*Standards, regulations, and legal
issues
Papers must be submitted
electronically.
Please submit papers through the following Paper Submission Link:
URL:
http://www.easychair.org/conferences/?conf=elcb2010
The format of submitted papers should
follow the guidelines for the IEEE conference proceedings, limited to 6
pages.
Accepted papers will be published in
the workshop proceedings of the ICEBE 2010 by the IEEE CS Press, and
will
be further invited for extension for publication in top international
journals,
including the International Journal of Applied Logistics (IJAL).
IMPORTANT DATES
Abstract registration deadline: June
22, 2010
Paper submission: July 6, 2010
Notification of acceptance: July 22,
2010
Camera-ready paper submission: August
5, 2010
Workshop Organizer
Dr. Zongwei Luo, The Univeristy of
Hong
Kong, China
Dr. Jen-Yao Chung, IBM T.J. Watson
Research
Center, USA